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A novel sample preparation technique for visualizing invisible defects embedded in poly gate

机译:可视化嵌入多晶硅门中的不可见缺陷的新型样品制备技术

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The use of nanoprobing techniques to accomplish transistor parametric data extraction has been widely reported as a method of failure analysis in nanometer scale science and technology. Certain failure mechanisms causing parametric transistor fails are, however, not always successfully identified, even using advanced imaging tools, such as transmission electron microscopy (TEM). Therefore, additional techniques are needed that can reveal the physical root cause of the electrical defects. In this paper, an approach using dopant selective etching of samples for TEM is adopted to enable visualization of invisible defects embedded in the poly gate.
机译:作为纳米级科学技术中的故障分析方法,已经广泛报道了使用纳米探测技术来完成晶体管参数数据提取。但是,即使使用先进的成像工具,例如透射电子显微镜(TEM),也无法始终成功地识别出导致参数晶体管故障的某些故障机制。因此,需要其他技术来揭示电气缺陷的物理根本原因。在本文中,采用了一种使用针对TEM的样品的掺杂剂选择性蚀刻的方法来实现可视化嵌入多晶硅栅中的不可见缺陷。

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