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Unveiling Spark Plasma Sintering High-Throughput Processing

机译:推出等离子烧结高通量加工

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Spark Plasma Sintering, and similar, technologies have been used in R&D and academia for compacting advanced ceramics, powder metals, and cermets for more than two decades. And SPS remains a highly sought-after research and development tool, because of its high speed processing, particle bonding attributes, and impressive material properties capabilities. Though there have been some attempts to apply this incredible technology to specific commercial projects, they remain largely unknown and are commonly veiled in a shroud of secrecy.This discussion is about removing the veil and looking closely at one detailed example of how SPS can be used commercially, today. We will review Thermal Technology LLC's High Throughput SPS process in detail and how it can be applied to a specific sputtering target application. We will detail throughput, operational costs, equipment costs, and touch on tooling design, and we'll break these expenses down to cost per part. We will also discuss some of the limitations of SPS with regard to commercial applications.
机译:火花等离子体烧结和类似的技术已被用于研发和学术界,用于压实先进的陶瓷,粉末金属和金属滤网超过二十年。由于其高速处理,粒子粘合属性和令人印象深刻的材料特性能力,因此SPS仍然是高度追捧的研发工具,仍然是高速处理,粒子粘接属性和令人印象深刻的材料特性能力。虽然有一些尝试将这种令人难以置信的技术应用于特定的商业项目,但它们仍然很大程度上是未知的,并且通常在保密的罩上蒙上蒙蒙。 这次讨论是关于去除面纱,并在今天可以在商业上使用SPS如何使用的详细示例。我们将详细审查热技术LLC的高吞吐量SPS过程,以及如何应用于特定的溅射目标应用。我们将详细介绍吞吐量,运营成本,设备成本和触摸工具设计,并将将这些费用降至每份成本。我们还将讨论SPS关于商业应用的一些局限性。

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