Design and test of high-speed mixed-signal/RF circuits and systems is undergoing a transformation due to the effects of process variations stemming from the use of scaled CMOS technologies that result in significant yield loss. To this effect, post-manufacture tuning for yield recovery is now a necessity for many high-speed electronic circuits and systems and is typically driven by iterative test-and-tune procedures. Such procedures create new challenges for manufacturing test and built-in self-test of advanced mixed-signal/RF systems. In this paper, key test challenges are discussed and promising solutions are presented in the hope that it will be possible to design, manufacture and test ÃÂÿtruly self-healingÃÂÿ systems in the near future.
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