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3D simulation and analysis of the radiation tolerance of voltage scaled digital circuit

机译:电压缩放数字电路的辐射容限的3D模拟和分析

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In recent times, dynamic supply voltage scaling (DVS) has been extensively employed to minimize the power and energy of VLSI systems. Also, sub-threshold circuits are becoming more popular. At the same time, the reliability of VLSI systems has become a major concern under Single Event Upsets (SEUs). SEUs are very problematic even for circuits operating at nominal voltages. With the increasing demand for low power reliable systems, it is therefore necessary to harden DVS and sub-threshold circuits efficiently. In this paper, we perform 3D simulations of radiation particle strikes in an inverter implemented using DVS and sub-threshold design. We analyze the sensitivity of the inverter to radiation particle strikes by varying the inverter size, the inverter load, the supply voltage (VDD) and the energy of the radiation particles. From these 3D simulations, we make several observations which are important to consider during radiation hardening of DVS and sub-threshold circuits. Based on these observations, we propose several guidelines for radiation hardening of DVS and sub-threshold circuit designs. These guidelines suggest that the traditional radiation hardening approaches need to be revisited for DVS and sub-threshold designs. We also propose a charge collection model for DVS circuits. Our model can accurately estimate (with an average error of 6.3%) the charge collected at the output of a gate for different supply voltages and different gate sizes for medium and high energy particle strikes. The parameters of our charge collection model can be included in SPICE model cards of transistors, to improve the accuracy of SPICE based radiation simulations for DVS circuits.
机译:近年来,动态电源电压缩放(DVS)已被广泛采用以最小化VLSI系统的功率和能量。同样,亚阈值电路也变得越来越流行。同时,VLSI系统的可靠性已成为单事件翻转(SEU)下的主要问题。即使对于在标称电压下工作的电路,SEU还是很成问题的。随着对低功率可靠系统的需求不断增加,因此有必要有效地加强DVS和亚阈值电路。在本文中,我们对使用DVS和亚阈值设计实现的逆变器进行辐射粒子撞击的3D模拟。我们通过改变逆变器尺寸,逆变器负载,电源电压(VDD)和辐射粒子的能量来分析逆变器对辐射粒子撞击的敏感性。从这些3D模拟中,我们进行了一些观察,这些观察在DVS和亚阈值电路的辐射硬化过程中需要考虑。基于这些观察,我们为DVS和亚阈值电路设计的辐射硬化提出了几项指南。这些准则表明,对于DVS和亚阈值设计,需要重新考虑传统的辐射硬化方法。我们还提出了DVS电路的电荷收集模型。我们的模型可以准确估计(平均误差为6.3%)针对中,高能粒子撞击的不同电源电压和不同栅极尺寸在栅极输出处收集的电荷。我们的电荷收集模型的参数可以包含在晶体管的SPICE模型卡中,以提高DVS电路基于SPICE的辐射仿真的准确性。

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