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Study on Optimization Problem of JUKI-2010 Mounter Mount

机译:JUKI-2010贴装机支架的优化问题研究

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摘要

Mount optimization problems directly related to the efficiency of surface-mount technology. In this paper, depending on the SMT Test Center JUKI-2010 Mounter as test platform, according to the model structure and mount process, the mount optimization problem is described as the minimum weight matching Problem (MWMP) and asymmetric traveling salesman Problem (TSP ), building a new optimization model is built to optimize the time into the distance optimization, Heuristics algorithm and application software programming. Through the six PCB board the comparative experiment is proved that the mathematical models and algorithms is reasonable. The results showed that: the production efficiency of an average has increased 2.14 percent.
机译:贴装优化问题直接与表面贴装技术的效率有关。本文以SMT测试中心JUKI-2010贴片机为测试平台,根据模型结构和贴装过程,将贴片优化问题描述为最小重量匹配问题(MWMP)和非对称旅行商问题(TSP)。 ,建立新的优化模型可将优化时间转化为距离优化,启发式算法和应用软件编程。通过六块PCB板的对比实验证明了该数学模型和算法是合理的。结果表明:平均生产效率提高了2.14%。

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