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CMOS readout integrated circuit involving pixel-level ADC for microbolometer FPAs

机译:涉及用于微辐射热计FPA的像素级ADC的CMOS读出集成电路

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The function of most readout integrated circuits (ROIC) for microbolometer focal plane arrays (FPAs) is supplying a bias voltage to a microbolometer of each pixel, integrating the current of a microbolometer, and transferring the signals from pixels to the output of a chip. However, the scale down of CMOS technology allows the integration of other functions. In this paper, we proposed a CMOS ROIC involving a pixel-level analog-to-digital converter (ADC) for 320 × 240 microbolometer FPAs. Such integration would improve the performance of a ROIC at the reduced system cost and power consumption. The noise performance of a microbolometer is improved by using the pixelwise readout structure because integration time can be increased up to 1ms.A Pixel circuit is consisted of a background skimming circuit, a differential amplifier, an integration capacitor and a 10-bit DRAM. First, the microbolometer current is integrated for 1ms after the skimming current correction. The differential amplifier operates as an op-Amp and the integration capacitor makes negative feedback loop between an output and a negative input of the op-Amp. And then, the integrated signal voltage is converted to digital signals using a modified single slope ADC in a pixel when the differential amplifier operates as a comparator and the 10-bit DRAM stores values of a counter. This readout circuit is designed and fabricated using a standard 0.35μm 2-poly 4-metal CMOS technology.
机译:大多数用于微辐射热计焦平面阵列(FPA)的读出集成电路(ROIC)的功能是向每个像素的微辐射热计提供偏置电压,积分微辐射热计的电流,并将信号从像素传输到芯片的输出。但是,按比例缩小的CMOS技术允许集成其他功能。在本文中,我们提出了一种针对320×240微辐射热计FPA的像素级模数转换器(ADC)的CMOS ROIC。这种集成将以降低的系统成本和功耗提高ROIC的性能。由于积分时间可以增加到1ms,因此通过使用像素方向的读出结构可以改善微辐射热计的噪声性能。 像素电路由背景略读电路,差分放大器,积分电容器和10位DRAM组成。首先,在撇除电流校正后,将微辐射热计的电流积分1ms。差分放大器作为运放工作,积分电容器在运放的输出和负输入之间形成负反馈环路。然后,当差分放大器用作比较器并且10位DRAM存储计数器的值时,使用像素中经过修改的单斜率ADC将积分信号电压转换为数字信号。该读出电路是使用标准的0.35μm2聚4金属CMOS技术设计和制造的。

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