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EARLY DEVELOPMENTS FOR A SEMI-ANALYTICAL MODEL OF WELD INDUCED RESIDUAL STRESS

机译:焊接残余应力半解析模型的早期发展

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The generation of plastic slip and residual stress by thermal processes is particularly difficult to understand and simulate. Modelling such problems is computationally expensive when approached numerically and extremely complex to approach analytically. 'Semi-analytical' models, in which analytical ther-moelastic solutions are combined with approximate models of plasticity, offer a way to bridge this gap and have the potential to allow the rapid testing of parameter sensitivities before one launches a time-consuming full numerical model. However the construction of such models within such a thermal framework poses its own problems. An initial requirement for any such semi-analytical model is a complete solution to the elastic only response of the material to the given loading process. In this paper we focus on the formulation of such a solution for the simplest case relevant to welding or similar thermal processing. We verify the solution developed against finite element predictions and then further investigate it. In doing so we explain how the nature of this solution, especially its predicted yielding behaviour, has ramifications for the successful creation of a full semi-analytical solution.
机译:通过热过程产生的塑性滑移和残余应力特别难以理解和模拟。对这些问题进行建模在数值上接近时在计算上是昂贵的,而在分析上则极其复杂。 “半分析”模型将分析性的热弹性解决方案与近似的可塑性模型结合起来,提供了一种弥合这一差距的方法,并有可能在启动耗时的完整数值之前快速测试参数敏感性。模型。然而,在这样的热框架内构造这样的模型存在其自身的问题。任何此类半分析模型的初始要求是对材料对给定加载过程的仅弹性响应的完整解决方案。在本文中,我们专注于针对与焊接或类似热处理相关的最简单情况的解决方案的制定。我们验证针对有限元预测开发的解决方案,然后对其进行进一步研究。通过这样做,我们解释了该解决方案的性质,尤其是其预期的屈服行为如何对成功创建完整的半分析解决方案产生了影响。

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