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Fabrication of Multiwall Carbon Nanotube-nanocrystalline Copper Nanocomposite Film by Electrochemical Deposition

机译:电化学沉积制备多壁碳纳米管-纳米晶铜纳米复合膜

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A new method of fabricating nanocomposite films made up of multiwall carbon nanotube and nanocrystalline copper was developed by using an electrochemical deposition. The electroplated CNT/Cu nanocomposites have the microstructure that CNTs are well dispersed in both the planar and depth directions without any voids in the matrix. The conditions were successfully achieved by using some amphiphilic polymers, organic additives and a pulse electrodeposition method. The microstructure and CNT composition of nanocomposite films were strongly affected by the concentration of CNT in the electrolyte. The mechanical and electrical properties of CNT/Cu nanocomposite films were investigated with the variation of CNT content in the nanocomposite films.
机译:利用电化学沉积技术开发了一种由多壁碳纳米管和纳米晶铜构成的纳米复合膜的新方法。电镀的CNT / Cu纳米复合材料具有微观结构,即CNT在平面方向和深度方向上均很好地分散,而基体中没有任何空隙。通过使用一些两亲性聚合物,有机添加剂和脉冲电沉积方法成功地达到了条件。纳米复合膜的微观结构和CNT组成受到电解质中CNT浓度的强烈影响。研究了碳纳米管/铜纳米复合膜的力学性能和电学性能,研究了碳纳米管复合膜中碳纳米管含量的变化。

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