As electronic packaging technology trends in the small flat panel display move toward faster, more cost-effective, higher electrical performance and better reliability , flip chip technology gains popularity as one of the best chip packaging candidates. This technology has offered numerous advantages over conventional solder joining and the assembly uses polymer adhesives such as isotropic conductive adhesives( ICAs) , anisotropic conductive films ( ACFs) and nonconductive adhesives(NCAs). ICAs and ACAs contain conductive particles and adhesive polymer resins and have been widely used for the flat panel display module. However, as the consumer electronics tends to become ligher, thinner, and also featured in high resolution and low power consumption to satisfy the increasing market requirements , it is propelling to improve the approaches to a flip chip adhesive process. The paper mainly presents the study of Non-conductive adhesives in flip chip for plat panel display. The NCAs technology is emerging as an attractive lead-free solder interconnects due to its environmental friendliness, lower processing temperatures, lower cost and extendability to fine pitch application. In fine pitch application below 30 μm , decreasing the pad pitch could increase the risk of short circuit to the ICA joints and lead to a reduction in current-carrying capacity of the ACA interconnetions. But the technology using NCAs in flip chip can solve the problems very well. This paper will review the latest research in NCA interconnection technology for flat panel display applications. Meanwhile , the new methods of NCA interconnection for very fine pitch LCD driver is also proposed and verified.
展开▼
