High Yield Intra-Cavity Interconnection Fabrication Method And Characterization Methodologies

摘要

Northrop Grumman Space Technology has demonstrated the capability to manufacture intra-cavity interconnections (ICICs), which consistently yield greater than 99%. These ICICs are an integral part of MMICs packaged at the wafer level using wafer bonding techniques. Efficient test structures were designed to evaluate these interconnects, allowing fast on-wafer assessment of interconnect yield in a production environment.