Performance Evaluation of a New Type of Jetting Dispenser Using Piezoelectric Actuator

摘要

This paper presents a new type of jetting dispenser featuring piezoelectric actuator in order to achieve high flow rate and small dot sizes in semiconductor packaging processes. After describing structural components of the dispensing mechanism and the operating principle, a dynamic modeling is undertaken by considering the behavior of the piezostack, hydraulic magnification, dispensing needle and adhesive fluid. In the modeling, fluid models for adhesive fluid and hydraulic magnification are derived with a dumped parameter method. The governing equation of motion is then derived by integrating the fluid models with structural model. Subsequently, the dynamic behavior of the dispenser and its dispensing amount are investigated by applying several types of square wave driving voltage input and design parameter values are determined.