Critical dimension: MEMS road map

摘要

The use of Micro-Electro-Mechanical Systems (MEMS) technology in mechanical, biotechnology, optical, communications, and ink jet is growing. Critical dimensions in MEMS devices are getting smaller and processes are constantly facing new metrology challenges. This paper will examine some critical dimension metrology needs and challenges for MEMS using resist-on-silicon structures. It is shown that the use of automated optical CD metrology can meet emerging measurement requirements while bringing the advantages of a non-destructive, high throughput and precise methodology.