In this study, we used optimized negative mode to detect N+/P-well contact open and P+/N-well contact leakage. We found the optimized contact process condition to eliminate both contact open and leakage. Electron beam (e-beam) inspection results strongly correlate with die yield. We implemented negative mode e-beam defect inspection along with positive mode inspection for effective inline monitoring to accelerate the 65 nm process yield ramp.
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