Thermal Stability at the Anisotropic Conductive Films (ACFs)/Organic Solderability Preservatives (OSPs) Interface

摘要

Failure surface analysis by SEM and XPS showed that OSP layers disappeared after heat treatment above 240 °C. Furthermore, FT-IR analyses of OSP layer showed that C=N bonding strength became stronger after heat treatment, and it was considered that Cu-N coordinate bonds that form the OSP layers were broken. Considering that the OSP layer remained after ACF bonding and OSP layer was weakness after heat treatment above 240 °C, interface between the ACFs and OSP treated Cu has a weakness for high temperature environment above 240 °C. Finally, in application to OSP finished rigid substrates-flexible substrates system, ACFs/OSP finished Cu electrodes interface was major failure site after heat treatment above 240 °C.