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STUDY ON THE RECYCLE OF SOLAR GRADE SILICON FROM WASTE IC WAFERS

机译:废硅晶片回收太阳能硅的研究

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The technology of recycling waste silicon wafers from IC industry which usually are highly doped was investigated in this paper. Two approaches were selected to remove the metal layers, intermediate layers and doping layers of the waste silicon wafers on the surface: sand-blasting and acid etching. After removing the impurities, the structure, electrical properties and impurities content were analysed through the SEM, resistance measurement and ICP-OES methods respectively. The results show that both two methods are effective to remove the impurities, however, the acid etching method is fit for both small pieces and large pieces of waste IC wafers, while sand-blasting is fit for the large waste silicon wafers. After removing, the impurities especially metal impurities are quite low enough, the recycled silicon wafers are still high B doped, if it used for PV, some measures such as by doping with high intrinsic silicon feedstock must be adopted.
机译:本文研究了回收工业中通常被重掺杂的集成电路工业废硅晶片的技术。选择了两种方法来去除表面上的废硅晶片的金属层,中间层和掺杂层:喷砂和酸蚀。去除杂质后,分别通过SEM,电阻测量和ICP-OES方法对结构,电性能和杂质含量进行了分析。结果表明,两种方法都可以有效地去除杂质,但是酸蚀刻法适用于小块和大块的废弃IC晶片,而喷砂处理则适合于大块的废硅晶片。去除后,杂质,特别是金属杂质足够低,回收的硅片仍是高B掺杂的,如果将其用于PV,则必须采取一些措施,例如掺杂高固有硅原料。

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