Estimating the impact of large design changes on field problems

摘要

The ACM Symposium on Solid and Physical Modeling and Applications is an annual international forum for the exchange of recent research results and applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. Previous symposia in this series were held in Austin, Texas, 1991; Montreal, Canada, 1993; Salt Lake City, Utah, 1995; Atlanta, Georgia, 1997; Ann Arbor, Michigan in 1999 and 2001; Saarbrucken, Germany, 2002; Seattle, Washington, 2003; Genova, Italy, 2004, Cambridge, Massachusetts, 2005; and Cardiff, Wales, United Kingdom, 2006. This is the first time ACM SPM will be held in Asia. >For additional information, please visit www.solidmodeling.org, the home page of The Solid Modeling Association that oversees this symposium series. >The SPM symposium series started initially with the name "ACM Symposium on Solid Modeling and Applications." To emphasize the fact that solid modeling entails not only handling their geometric shapes, but also their physical properties and behaviors, the name of the symposium was expanded to The ACM Symposium on Solid and Physical Modeling and Applications (abbreviated as SPM) in 2005. >SPM'07 was run in single track plenary sessions from Monday June 4 to Wednesday June 6, and was hosted by Tsinghua University, Beijing, China. Ninety four technical papers have been submitted and were reviewed by the international program committee with 87 expert reviewers from around the world. >At least three external reviewers and members of the program committee reviewed and discussed each submission. A total of 25 refereed papers have been selected for plenary presentation and publication in the proceedings as full papers. Moreover, a total of 26 refereed papers have been selected for poster presentation and publication in the proceedings as short papers. >The symposium program also includes three invited presentations by Gershon Elber, Herbert Edelsbrunnerand Shing-Tung Yau, all leading researchers in their fields.