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Highly Arsenic Doped CdTe Layers for the Back Contacts of CdTe Solar Cells

机译:CdTe太阳能电池背触点的高砷掺杂CdTe层

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In an effort to overcome the lack of a suitable metal as an ohmic back contact for CdTe solar cells, a study was carried out on the potential for using a highly arsenic (As) doped CdTe layer with metallization. The deposition of full CdTe/CdS devices, including the highly doped CdTe:As and the CdCl2 treatment, were carried out by metal organic chemical vapour deposition (MOCVD), in an all-in-one process with no etching being necessary. They were characterized and compared to control devices prepared using conventional bromine-methanol back contact etching. SIMS and C-V profiling results indicated that arsenic concentrations of up to 1.5 × 1019 atoms•cm~-3 were incorporated in the CdTe. Current-voltage (J-V) characteristics showed strong improvements, particularly in the open-circuit voltage (Voc) and series resistance (Rs): With a 250 nm thick doped layer, the series resistance was reduced from 9.8 Ω•cm2 to 1.6 Ω•cm2 for a contact area of 0.25 cm2; the J-V curves displayed no rollover, while the Voc increased by up to 70 mV (~ 12 % rise). Preliminary XRD data show that there may be an As2Te3 layer at the CdTe surface which could be contributing to the low barrier height of this contact.
机译:为了克服缺少适合的金属作为CdTe太阳能电池的欧姆背接触的问题,对使用高砷(As)掺杂的CdTe层进行金属化的潜力进行了研究。完整的CdTe / CdS器件的沉积,包括高掺杂的CdTe:As和CdCl2处理,是通过金属有机化学气相沉积(MOCVD)在一站式过程中完成的,而无需蚀刻。对它们进行了表征,并与使用常规溴-甲醇背接触蚀刻制备的控制设备进行了比较。 SIMS和C-V分析结果表明,CdTe中掺入的砷浓度最高为1.5×1019atoms•cm〜-3。电流-电压(JV)特性得到了显着改善,尤其是在开路电压(Voc)和串联电阻(Rs)方面:使用250 nm厚的掺杂层,串联电阻从9.8Ω•cm2降至1.6Ω•。接触面积0.25 cm2时为cm2; J-V曲线显示没有翻转,而Voc上升了70 mV(上升了12%)。初步的XRD数据表明,在CdTe表面可能存在As2Te3层,这可能有助于降低该接触的势垒高度。

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