Growth Kinetics of the Intermetallic Layer at the Interface of Solid Metals with Liquid Soldering Alloys

摘要

Mechanism and kinetics of formation of an intermetallic layer at the interface of a solid metal with a liquid solder are analyzed from a physico-chemical viewpoint. Mathematic equations allowing estimation of the thickness of an intermetallic layer under conditions of its dissolution in the solder melt are proposed. An example of calculations with the Ni_3Sn_4 intermetallic layer at the interface of nickel and a Pb-free Sn-base solder is presented.