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Wrapper Design for the Reuse of Networks-on-Chip as Test Access Mechanism

机译:将片上网络复用为测试访问机制的包装设计

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This paper proposes a wrapper design for interconnects with guaranteed bandwidth and latency services and on-chip protocol. We demonstrate that these interconnects abstract the interconnect details and provide predictability in the data transfer, which are desirable not only for the functional domain but also for the test application. The proposed wrapper is implemented in VHDL and integrated to the Æthereal NoC. The results show the impact of of bandwidth in the core test time. The wrapper area and core test time are compared with a wrapper design for dedicated TAM.
机译:本文提出了一种用于互连的包装器设计,该互连器具有保证的带宽和等待时间服务以及片上协议。我们证明了这些互连抽象了互连细节,并提供了数据传输中的可预测性,这不仅对于功能域而且对于测试应用程序都是理想的。拟议的包装器在VHDL中实现,并集成到了“真实的NoC”中。结果显示带宽对核心测试时间的影响。将包装面积和核心测试时间与专用TAM的包装设计进行了比较。

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