Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

摘要

Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. An event driven simulator in combination with a 3D placement tool was used to predict the total system volume. The potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implementations.