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Novel Device structures for Sub-25nm Generation

机译:低于25nm的新型器件结构

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摘要

Aggressive MOSFET scaling faces the challenges of limited Ion/loff ratio and severe short channel effects. The problems facing mixed mode circuits are equally daunting. While very high FTand Fmaxcan be realized, these small transistors have unacceptably low intrinsic gain (gmrO). Small supply voltage also posts real constraint in circuits. To overcome these problems, new device configurations made feasible by small dimensions and new materials need to be explored. In this paper, novel devices incorporating silicon and germanium are presented. These silicon and germanium based novel transistors with superior performance have the potential to alleviate the scaling challenges for sub-25nm nodes.
机译:激进的MOSFET缩放面临着有限的离子/关断比和严重的短沟道效应的挑战。混合模式电路面临的问题同样令人生畏。尽管可以实现很高的F T 和F max ,但是这些小型晶体管的固有增益非常低(g m r O < / inf>)。小电源电压也会对电路产生实际限制。为了克服这些问题,需要探索通过小尺寸和新材料变得可行的新设备配置。在本文中,提出了结合硅和锗的新型器件。这些具有优异性能的基于硅和锗的新型晶体管具有缓解低于25nm节点的缩放挑战的潜力。

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