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PROCESSING CHARACTERISTICS OF PSU/PC BLEND ASSOCIATED WITH DEGRADATION IN INJECTION MOLDING

机译:注塑成型过程中与降解相关的PSU / PC共混物的加工特性

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This study investigates the effect of degradation of the PSU/PC blend (SMA-8~(TM)) on quality characteristics of the molded parts. Experiments were conducted at two sets of melt temperatures - 'normal' temperature, where no severe degradation is expected (T-zone 1); and 'elevated' temperature, where significant degradation should occur (T-zone 2). ASTM D638 tensile bars were used for molding and measured for quality parameters of part weight, warpage, and tensile strength. Small fluctuations in the process variables were purposely introduced for T-zone 1 and T-zone 2. As the results, T-zone 1 provided more consistent shot-to-shot part properties and less process disturbances for all the parameters than T-zone 2. The subsequent baking of the molded parts rendered most of the parts excessively warped for T-zone 2. Back pressure was an important variable regarding shot-to-shot variations in all the parameters.
机译:这项研究调查了PSU / PC共混物(SMA-8〜(TM))的降解对成型零件质量特性的影响。实验是在两组熔融温度下进行的:“正常”温度,预计不会出现严重降解(T区1);和“升高的”温度,在该温度下应发生明显的降解(T区2)。使用ASTM D638拉伸棒进行成型,并测量零件重量,翘曲和拉伸强度的质量参数。特意为T区1和T区2引入了工艺变量的小波动。结果,与T区相比,T区1提供了更一致的焊点到焊点零件特性,并且所有参数的工艺干扰都更小2.随后对模制零件的烘烤使大多数零件在T区变形过大。2.关于所有参数的逐次变化,背压是一个重要的变量。

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