Innovative connector technology realizes performance, density and manufacturing simplicity

摘要

Most traditional high-speed backplane connectors have been designed to emulate the behavior and structure of either stripline or microstrip transmission lines. They have typically included vertical shields between columns of contacts to control impedance and reduce crosstalk. By contrast, a new connector technology utilizing edge-coupling between contact blades to control the impedance of each differential pair is explored. An optimized stagger or offset is presented which minimizes crosstalk in the connector and via field of the connector footprint. To demonstrate the technology a sample device was constructed and evaluated. Measurements were made on active and passive backplane systems running successfully at data rates up to 10 Gbit/s. Multiport vector network analyzer measurements as well as time domain instruments were used to characterize the sample device as well as the backplane systems. This paper describes an approach that can be used to reduce crosstalk and enhance performance of multi-conductor transmission structures in high speed interconnects, including via fields, connectors and dense backplanes. The approach was realized with a sample to verify the predicted behavior and determine the level of correlation between theory and practice.