A reliability study to evaluate new compliant designs used in high speed signal applications

摘要

As high-speed electronic packaging systems continue to drive to higher bandwidth a common approach to packaging such systems is to distribute signals and connect various components in a multi-layer printed circuit board (PCB). Methods to achieve the higher system bandwidth requirement can be broken down into two categories, faster signal speed and higher density interconnects. In order to increase the signal speed, the plated through hole (PTH) had to be reduced in order to minimize the capacitive discontinuity effects. A preferred termination method to these reduced PTH structures is the compliant pin because of its robustness, easy assembly methods, and repairability. However, the reduction of the PTH diameter size has forced component designers to miniaturize the compliant pin, therefore raising concerns about the reliability of the pin. This work discusses experimental and analytical results to show that the new compliant pin designs meet the electronic industry's reliability standards and requirement for higher bandwidth. Four types of compliant pin designs were analyzed and put through a series of environmental and test to failure groups. The contact resistance change was monitored throughout the test groups and used to assess the pins' reliability.