首页> 外文会议>Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on >A test-chip to characterize the benefit of on-chip decoupling to reduce the electromagnetic emission of integrated circuits
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A test-chip to characterize the benefit of on-chip decoupling to reduce the electromagnetic emission of integrated circuits

机译:一种测试芯片,用于表征芯片上去耦的好处,以减少集成电路的电磁辐射

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We present two test-chips, which were used to characterize the influence of the placement of on-chip decoupling capacitor blocks on the electromagnetic emission of integrated circuits. In general the electromagnetic emission could be reduced by the use of on-chip capacitors, but also an increase of the emission is possible, when these capacitors are not optimally placed.
机译:我们介绍了两个测试芯片,这些芯片用于表征芯片上去耦电容器块的放置对集成电路电磁辐射的影响。通常,可以通过使用片上电容器来减少电磁辐射,但是当这些电容器不是最佳放置时,也可以增加辐射。

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