Multimode, parallel optoelectronic transceivers are increasingly popular for short to medium distance data communication applications because of low EMI, good noise rejection, high I/O density and a plug-n-play interface plus the promise of low cost. Improved assembly and packaging technology must be demonstrated to make the promise of value-parity with electronic interconnect a reality however. This paper discusses a non-traditional multimode transceiver assembly process using 3M pressure sensitive adhesive transfer tapes, which can meet multimode alignment tolerances, and environmental reliability requirements without complex dispense, curing and cleaning operations. This technology is being demonstrated to meet the challenges of low-cost optoelectronics transceiver assembly under the DataPipe NIST ATP sponsored program.
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