Copper electroplating for Thick-film power applications: A successful laboratory method for prototyping

摘要

Electroplating was used to improve the conduction of polymer conductors. Three baths were investigated, Sulfate, Pyrophosphate and Fluoborate. The pyrophosphate proved messy, as it should have been heated so the results were not good. The other two baths worked very well. It was shown that to achieve a good plate the sample must be vertical and washed with gas bubbles. Additives were shown to improve the surface greatly. Robbing was effective to reduce high current density areas. A circuit for high frequency pulse and periodic reversal is included. The use of pulse and PR was shown to also improve the edge effect. Deplating current should be 25% of plating current unless at very high frequency, requiring a higher deplating curent. A PR of up to 20KHz was used with success.