Sensor Production Cost Savings Methods

摘要

The need for technical innovation is always present in today's economy. Micro Electro Mechanical Systems, MEMS has generated recent innovation enabling applications ranging from game controllers and sensor based systems to broadband telecommunication cross connect switching systems. In high volume applications cost of ownership and return on investment play a significant role in the commercialization of MST. Today new machines are moving into the front and back end of substrate fabrication. Silicon on Insulator (SOI), material desired for many applications, is an example where substrate bonding has enabled price and performance advantages from conventional techniques such as SIMOX. Often process parameters and environment such as temperature and contamination control will limit the selection of materials that would be best suited for cost or performance advantages in the manufacturing of MEMS. Recent developments in process tools that allow multi level bonding or stacking of various materials have gained popularity. This technique of vertical integration or even hybrid construction allows for the optimal process solution whereby individual fabrication techniques can be used without constraint. Aligned substrate bonding has developed into high volume production solutions that meet the ever-increasing needs for fabrication and performance criteria. This presentation will update the audience on recent developments for high volume production of MEMS / MST.