Sensors and sensor-based systems are increasingly being utilized in harsh environment applications. These applications rely heavily on packaging to provide thermal stability, media compatibility, and protection against mechanical shock and other environmental factors. With the application environment becoming increasingly severe, even greater emphasis will be placed on the need to protect theses devices and to ensure optimal operational functionality in the worst conditions. As a result, packaging has become a critical consideration in the design of these devices from both a total system solution cost, and a product performance perspective. This course will address the various polymeric material packaging solutions available to design and materials engineers and will discuss how different materials can be utilized to facilitate performance in harsh environments. The course will address the impact of these material solutions on total system cost as well as their ability to provide maximum design latitude to engineers. The course will appeal to sensor design engineers as well as users of sensor and sensor-based systems.
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