Recently, the requirement of the PCBs of the environmentally harmonious type is becoming more severe. We have developed an original high-filled technology for halogen-free materials. The point of this core technology is the introduction of a new filler interphase control system (FICS), which enables the higher dispersion of the filler. The halogen-free high Tg laminate and high Tg build-up material for HDI PCBs/IC packages, which can be applied to the diversified needs, have been developed using this technology. These materials have excellent heat resistance and are suitable for lead-free solder as well. Furthermore, these materials have a high elasticity modulus and are most suitable for very thin ICs. The synthetic board design of the environmentally harmonious type becomes easier by combined use of these materials.
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