首页> 外文会议>European Test Workshop, 2000. Proceedings. IEEE >Defect detection from visual abnormalities in manufacturing process using I/sub DDQ/
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Defect detection from visual abnormalities in manufacturing process using I/sub DDQ/

机译:使用I / sub DDQ /从制造过程中的视觉异常检测缺陷

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Abnormal I/sub DDQ/ (quiescent V/sub DD/ supply current) indicates the existence of physical damage in a circuit. Using this phenomenon, a CAD-based fault diagnosis technology has been developed to enhance the manufacturing yield of logic LSI. This method to detect the fatal defect fragments in several abnormalities identified with wafer inspection apparatus includes a way to separate various leakage faults, and to define the diagnosis area encircling the abnormal portions. The proposed technique progressively narrows the faulty area by using logic simulation to extract the logic states of the diagnosis area, and by locating test vectors related to abnormal I/sub DDQ/. The fundamental diagnosis way employs the comparative operation of each circuit element to determine whether the same logic state with abnormal I/sub DDQ/ exists in normal logic state or not.
机译:I / sub DDQ /(静态V / sub DD /电源电流)异常表示电路中存在物理损坏。利用这种现象,已经开发了基于CAD的故障诊断技术以提高逻辑LSI的制造成品率。用晶片检查装置识别出的几种异常中的致命缺陷碎片的检测方法包括分离各种泄漏故障并确定围绕异常部分的诊断区域的方法。所提出的技术通过使用逻辑仿真提取诊断区域的逻辑状态,并通过定位与异常I / sub DDQ /相关的测试向量来逐步缩小故障区域。基本的诊断方法是利用每个电路元件的比较运算来确定在正常逻辑状态下是否存在具有异常I / sub DDQ /的相同逻辑状态。

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