LASCA-interconnect parasitic extraction tool for deep-submicron IC design

摘要

A fast capacitance and resistance extraction tool (wire extractor) is presented. Five models are implemented: ground capacitances, ground plus coupling capacitances and RC models (L, /spl pi/ and T lumped). The designer can choose one of these models according some criteria, such as accuracy, CPU time and circuit complexity. Comparisons between our wire extractor and Diva extractor (Cadence Design Systems) for C models, give an average difference of only 5% in the final delay of some benchmarks, being up to 30 times faster than Diva.