Current and future EMI challenges at Intel and how to manage them

摘要

Most EMI issues have been resolved using expensive enclosures and gaskets at the system level. In addition, simple components such as decoupling and filtering devices were added to the board to reduce power plane and I/O (input/output) port noise. These were acceptable methodologies in the past when clock frequencies were low (>33 MHz), and cost pressures were less 'overbearing'. However, these approaches are not possible due to increasing frequencies (/spl sim/ GHz) and power (/spl sim/100 W) requirements. The traditional methods are not working since the chassis has limited shielding effectiveness above 1 GHz, and decoupling and filtering devices are ineffective at high frequencies. In addition, with the popularity of the value PC, it is undesirable to add cost to the system. This paper summarizes the historical problems and solutions encountered at Intel, and providing few approaches that have yielded great benefits in terms of solution and cost. In addition, future approaches for effective EMI management at the system, board, and component levels are discussed.