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Stress analysis of shrink fitted joints of solid shafts and three-dimensional photoelastic experiment

机译:实心轴套合接头的应力分析及三维光弹实验

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In this paper, shrink fitted jints of solid shaft and ring made of epoxide resin were assembled and photoelastic experiments were carried out. Isochromatic fringe patterns in the shrink fitted joint were measured using the three-dimensional stress freezing method. Then, the contact stress distributions in the shrink fitted joint of the ring and the solid shaft were analyzed using the finite element method. The three models, i.e., with slip, without slip and with partial slip at the interface were analyzed and the results were compared. The effects of chamfer at the edge of the interface and the material proerties of the ring (hollow cylinder) on the contact stress distributions were examined.
机译:本文组装了由环氧树脂制成的实心轴和环的紧配合接头,并进行了光弹性实验。使用三维应力冻结法测量收缩配合接头中的等色条纹图案。然后,使用有限元方法分析了环和实心轴的热缩配合接头中的接触应力分布。分析了三种模型,即在界面处有滑移,无滑移和有部分滑移的模型,并比较了结果。研究了在界面边缘的倒角和环(空心圆柱体)的材料性能对接触应力分布的影响。

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