首页> 外文会议>Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERPACK'99 >The Use of Phase Change materials for Elecfronic Cooling Applications: Thermal Design lssues and Example
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The Use of Phase Change materials for Elecfronic Cooling Applications: Thermal Design lssues and Example

机译:相变材料在电子冷却应用中的使用:热设计问题和示例

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Phase Change Materials (PCMs) are being considered for electronic cooling applications throughout academia and industry. Design issues for the use of PCMs are discussed for the example of a finned PCM heat exchanger. Issues of importance are thermal design load, PCM selection, thermal modeling of PCM systems, and the econmics of each system. Options for modeling PCM systems are presented and discussed. These options include detailed computational fluid dynamic models or simplified circuit analogy models. A simplified ciruit analogy model is developed and compared to CFD results and found to be in good agreement for identical operating conditions.
机译:相变材料(PCM)正在整个学术界和整个行业中用于电子冷却应用。以翅片PCM热交换器为例,讨论了使用PCM的设计问题。重要的问题是热设计负载,PCM选择,PCM系统的热建模以及每个系统的经济性。介绍和讨论了用于PCM系统建模的选项。这些选项包括详细的计算流体动力学模型或简化的电路类比模型。开发了简化的电路模拟模型,并将其与CFD结果进行比较,发现在相同的工作条件下,它们具有很好的一致性。

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