Abstract: The Dynamic InfraRed Scene Projector (DIRSP) meets Army requirements for low-background hardware-in-the-loop testing of imaging infrared sensors. These requirements are met using cryogenic, vacuum technology to cool optical elements and emitter array sources. This paper discusses design and fabrication of two DIRSP subsystems, the Environmental Conditioning Subsystem, and the Mounting Platform Subsystem. These two subsystems enclose and support the Projection Optics Subsystem, and the Infrared Emitter Subsystem.!0
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