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CONTRIBUTION TO LASER CUTTING OF CIRCUIT BOARD STENCILS

机译:激光切割电路板模具的贡献

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For the last twenty years laser cutting/processing has been wide accepted and has continued to increase in a particularly rapid manner as standard cutting technique due to the large number of advantages achieved by this technique in comparison with the conventional methods /i.e. chem-etch stencils/. Excellent paste printing performance with high resolution / 20 mil and lower pitch apertures/, wide variety of stencil materials and no disposal as a serious environmental concern. Motor control optical focal length positioning is developed with higher accuracy, trapezoidal aperture walls /reduced dross/ and less stencil clogging. CO2 laser system driven from PCB CAD / CNC data with introducing uniform spatial laser pulse distribution on working sample.
机译:在过去的二十年中,由于激光切割/加工与常规方法相比具有许多优点,因此激光切割/加工作为标准切割技术已经以特别迅速的方式持续增长。化学蚀刻模版/。出色的锡膏印刷性能,具有高分辨率/ 20 mil和较小的节距孔//多种模板材料,并且没有作为严重的环境问题而丢弃。电机控制光学焦距定位技术具有更高的精度,梯形孔壁/减少的浮渣/以及更少的模板堵塞。由PCB CAD / CNC数据驱动的CO2激光系统,在工作样品上引入均匀的空间激光脉冲分布。

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