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Small Lot Repair/Manufacture of Microcircuit Boards by Laser Deposition

机译:激光沉积小批量修复/制造微电路板

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Report developed under SBIR contract. Studied the feasibility of using LaserChemical Vapor Deposition (LCVD) technology to repair electronic boards and to manufacture small lot microcircuit boards. An LCVD system was built and a gold organometallic gas was synthesized for the process. Gold patterns with line widths ranging from a few microns up to 200 microns were written. Various substrates (Alumina, Polyimide, Silicon Nitride) were written on to determine the diversity of the process. A larger system capable of housing 2 feet in two directions, was designed on paper. The proposed system would be capable of removing unwanted metal, via ablation and laying down new metal in any desired area with sub-micron accuracy. The LCVD technique parallels much of the current technology in laser ablation and trimming. Sub-micron accuracy, laser sources, vision systems and chemical vapor deposition are well developed areas Integrating these areas to do LCVD specifically will be a straight forward task. The areas in this technology that will need to be improved is the write rates and resolution that is achievable using conventional lasers and optics. It is the opinion of this company that this technology can be used immediately in the hybrid microcircuit and older monolithic microcircuit arena and with further research will compete with photolithography in the semiconductor business.

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