首页> 外文会议>Indium Phosphide and Related Materials, 1999. IPRM. 1999 Eleventh International Conference on >Proposal of buried metal heterojunction bipolar transistor and fabrication of HBT with buried tungsten
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Proposal of buried metal heterojunction bipolar transistor and fabrication of HBT with buried tungsten

机译:掩埋金属异质结双极晶体管的建议以及用掩埋钨制造HBT

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We propose a buried metal heterojunction bipolar transistor (BM-HBT), in which buried metal in the collector layer could reduce the total base-collector capacitance. To show the possibility of making a BM-HBT, we fabricated an InP-based HBT with buried tungsten mesh replacing the subcollector layer, where tungsten mesh works as a Schottky collector electrode. A flat heterostructure on the InP collector layer of the buried tungsten mesh was confirmed by a cross-sectional SEM view. A DC current gain of 12 was measured from the common-emitter collector I-V characteristics.
机译:我们提出了一种掩埋金属异质结双极晶体管(BM-HBT),其中,在集电极层中掩埋金属可以降低总的基极-集电极电容。为了显示制造BM-HBT的可能性,我们制造了一种基于InP的HBT,用掩埋的钨网代替了子集电极层,其中钨网用作肖特基集电极。通过截面SEM图确认了埋入的钨网的InP集电体层上的平坦异质结构。根据共射极集电极的I-V特性测得的直流电流增益为12。

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