首页> 外文会议>Electron Devices Meeting, 1999. IEDM Technical Digest. International >Electrical properties of submicron (/spl ges/0.13 /spl mu/m/sup 2/) Ir/PZT/Ir capacitors formed on W plugs
【24h】

Electrical properties of submicron (/spl ges/0.13 /spl mu/m/sup 2/) Ir/PZT/Ir capacitors formed on W plugs

机译:W插头上形成的亚微米(/ spl ges / 0.13 / spl mu / m / sup 2 /)Ir / PZT / Ir电容器的电性能

获取原文

摘要

Summary form only given. High-density, embedded ferroelectric memory (FeRAM) has the potential to replace embedded flash, embedded DRAM, and non-cache SRAM and could be a key enabler for future system-on-a-chip applications. Despite this appeal, the evidence that ferroelectric capacitors can be scaled to the submicron regime has been limited. In this paper, we report the fabrication and electrical properties of submicron PZT capacitors formed using both planar bottom electrodes and W plug contact structures. We observe that the aggregate saturation polarization value is nearly independent of individual capacitor area in the measured range from the contact-limited size of 0.12 /spl mu/m/sup 2/ to 10/sup 4/ /spl mu/m/sup 2/. This result suggests that high-density, embedded FeRAM technology may be feasible.
机译:摘要表格仅给出。高密度,嵌入式铁电存储器(FERAM)有可能更换嵌入式闪存,嵌入式DRAM和非高速缓存SRAM,并且可以成为未来系统的芯片应用的关键推动器。尽管如此,虽然有限,铁电电容可以缩放到亚微米制度的证据。在本文中,我们报告了使用平面底部电极和W插塞接触结构形成的亚微米PZT电容器的制造和电性能。我们观察到聚集饱和偏振值几乎独立于测量范围内的各个电容器区域,从0.12 / SPL mu / m / sup 2 /〜10 / spec 4 / spl mu / m / m / m / m / m / m / sp 2 /。该结果表明,高密度,嵌入式Feram技术可能是可行的。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号