This paper presents a new pixel architecture for an infra red sensor array based on a pyroelectric polymer. The pyroelectric polymer sensor is integrated with the CMOS charge amplifier. The fill factor of the sensor is optimised by placing the amplifier structure directly behow the sensing area. The maximum responsivity is 240 V/W and the specific detectivity is of the order of 10~6 cm./Hz/W.
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机译:本文提出了一种基于热释电聚合物的红外传感器阵列的新像素架构。热电聚合物传感器与CMOS电荷放大器集成在一起。通过将放大器结构直接放置在感应区域上,可以优化传感器的填充系数。最大响应率为240 V / W,比检测率约为10〜6 cm./Hz/W。
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