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New model for piezoresistive properties of highly doped p-type polysilicon

机译:高掺杂p型多晶硅压阻特性的新模型

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This paper describes new approach to modellingpiezoresistive properties of polycrystalline semiconductors. The model combines the electro-physical properties of microcrystalline silicon films with that of monocrystalline silicon in the way that the former properties are attributed to the grain boundaries regions whereas the latter-to intragrain regions. The model is used to describe the dpeendence of gausge factor (GF) and its temperature coefficient (TCGFV) of the higyly boron doped polycrystalline silicon, 4.10~(25)... 10~(27) m~(-3), on the dopant concentration for diffeent grain sizes, 10~(-8)...10~(-6) m. It is concluded that for very high dopijg level the zero or even positive TCGF can be otained.
机译:本文介绍了一种新的建模多晶半导体压阻特性的方法。该模型将微晶硅膜的电物理特性与单晶硅的电物理特性结合在一起,从而将前者的特性归因于晶界区域,而后者归因于晶粒内区域。该模型用于描述高硼掺杂多晶硅4.10〜(25)... 10〜(27)m〜(-3)的高斯因数(GF)与其温度系数(TCGFV)的相关性。不同晶粒尺寸的掺杂浓度为10〜(-8)... 10〜(-6)m。结论是,对于非常高的多巴胺水平,可以获得零或什至为正的TCGF。

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