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Bistable planar polysilicon microactuator with shallow arch-shaped leaf springs

机译:浅拱形叶簧的双稳态平面多晶硅微致动器

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Bi-stable microactuators are necessary to implement optical switch and microrelay with low power and high reliability. In this work, we analyzed the buckling and vibration characteristics of a planar microactuators with shallow arch- shaped leaf springs. To investigate elastic stability of the proposed microactuator, we derived static buckling modes. A concentrated force of 0.35 mu@N at the center of beam was required for the snap-through motion for the beam length of 1600 micrometer, thickness of 3 micrometer, beam width of 6.5 micrometer and initial rise of 15 micrometer considering only the first buckling mode. We also analyzed vibration characteristics of arch-shaped leaf spring. The resonant frequencies of the first modes across over the second mode and keeps constant resonant frequencies over the cross point. On the contrary, the resonant frequencies of second modes become almost constant regardless of initial rise. The planar microactuator with shallow arch-shaped leaf springs at both sides were fabricated using silicon micromachining technology. The vertical structure of the planar microactuator features simplicity and consists of p-doped polysilicon as a structural layer and LTO (Low Temperature Oxide) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress and HF GPE (gas-phase etching) process was finally employed in order to release the microactuators. These bi- stable planar microactuators with shallow arch-shaped leaf springs showed a high stiffness against external disturbance, and would be very useful for the stable operation of micro optical switch and microrelay.
机译:双稳态微致动器是使用低功率和高可靠性实现光开关和微量焊剂的。在这项工作中,我们分析了用浅拱形叶片弹簧的平面微致动器的屈曲和振动特性。为了研究所提出的微致动器的弹性稳定性,我们衍生出静态屈曲模式。浓缩力为0.35μm,在光束中心处的射频运动需要1600微米,厚度为3微米,光束宽度为6.5微米,初始上升15微米,考虑到第一次屈曲模式。我们还分析了拱形板簧的振动特性。在第二模式上跨越第一模式的谐振频率并在交叉点上保持恒定的谐振频率。相反,无论初始上升如何,第二种模式的谐振频率都变得几乎是恒定的。使用硅微机械技术制造两侧具有浅拱形叶片弹簧的平面微致动件。平面微致动器的垂直结构具有简单性,并且由p掺杂的多晶硅作为结构层和LTO(低温氧化物)作为牺牲层组成。多晶硅对残余应力的松弛进行退火,并且最终采用HF GPE(气相蚀刻)工艺以释放微致动器。这些具有浅拱形叶片弹簧的双稳定的平面微致动件显示出对外部干扰的高刚度,并且对于微光学开关和微轮芯的稳定运行非常有用。

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