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Automatic alternative phase-shift mask CAD layout tool for gate shrinkage of embedded DRAM in logic below 0.18 um

机译:自动替代相移掩模CAD布局工具,用于逻辑嵌入式DRAM的栅极收缩低于0.18 um

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An automatic alternative phase shift mask (PSM) pattern layout tool has been newly developed. This tool is dedicated for embedded DRAM in logic device to shrink gate line width with improving line width controllability in lithography process with a design rule below 0.18 $mu@m by the KrF excimer laser exposure. The tool can crete Levenson type PSM used being coupled with a binary mask adopting a double exposure method for positive photo resist. By using graphs, this tool automatically creates alternative PSM patterns. Moreover, it does not give any phase conflicts. By adopting it to actual embedded DRAM in logic cells, we have provided 0.16 $mu@m gate resist patterns at both random logic and DRAM areas. The patterns were fabricated using two masks with the double exposure method. Gate line width has been well controlled under a practical exposure-focus window.
机译:新开发了一种自动替代相移掩模(PSM)模式布局工具。该工具专用于逻辑设备中的嵌入式DRAM,以收缩栅极线宽,通过KRF准分子激光曝光,设计规则的光刻过程中的线宽可控性提高了栅极线宽。该工具可以克雷特Levenson型PSM与采用双曝光方法的二进制掩模耦合,用于正面照片抗蚀剂。通过使用图形,此工具会自动创建备用PSM模式。此外,它不会给出任何相冲突。通过采用逻辑单元格中的实际嵌入式DRAM,我们在随机逻辑和DRAM区域提供了0.16 $ MU @ M抗蚀器图案。使用两种掩模具有双曝光方法的图案制造。栅极线宽在实际曝光焦点窗口下得到了很好的控制。

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