Use of a CCD camera for the thermographic study of a transient liquid phase bonding process in steel

摘要

The bonding of steel pieces and the development of novel soldering methods, appropriate to the extended variety of applications of steels nowadays, bring the sensing of temperature an outstanding role in any metallurgical process. Transient liquid phase bonding (TLPB) processes have been successfully employed to join metals, among them steels. A thin layer of metal A, with a liquids temperature T_(LA), is located between two pieces of metal B, with a liquids temperature T_(LB) higher than T_(LA). The joining zone is heated up to a temperature T (T_(LA)