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Bridging fault detection in FPGA interconnects using IDDQ

机译:使用IDDQ在FPGA互连中桥接故障检测

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This paper presents a vector generation approach for testing interconnects in configurable (SRAM-based) Field Programmable Gate Arrays (FPGAs). The proposed approach detects bridging faults and is based on quiescent current (IDDQ monitoring. Compared with previous voltage-based methods, IDDQ testing has the advantage of utilizing a small number of programming phases for configuring the FPGA during the test process with negligible observability requirements, even under multiple faults. Algorithms for test generation which exploit the homogeneous nature of the FPGA array, are described. An example using the XC4000 is described in detail. For testing the XC4000 series interconnect, a total of 20 phases and 11 vectors are required: 11 phases for S (switch) block testing, and 9 phases for C (connection) block testing.

机译:

本文介绍了用于测试可配置(基于SRAM)现场可编程门阵列(FPGA)互连的矢量生成方法。所提出的方法检测桥接故障并基于静态电流(<斜体> i ddq 监控。与以前的基于电压的方法相比,<斜体> i ddq 测试具有利用少量编程阶段来配置FPGA在测试过程中,即使在多个故障下也可以忽略不计的可观察性要求。用于开发FPGA阵列的均匀性质的测试生成算法描述。使用XC4000的示例详细描述。用于测试XC4000系列互连,总共需要20个阶段和11个向量:S(开关)块测试的11个阶段,以及C(连接)块测试的9个阶段。

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