COMPUTER SIMULATIONS OF Bi-2223 SINTERED BULK

摘要

Models for Bi-2223 ceramic processing and fracture, which is obtained by hot-pressing, are discussed. Computer simulation was applied to phenomena occurring during sintering, cooling, and following fracture due to the macrocrack growth. The effects of Ag particles dispersed into the Bi-2223 matrix on some strength properties were studied. Finally, a numerical model for the ceramic conductivity investigation is presented, along with some effective characteristics that were discovered.