首页> 外文会议>Symposium on amorphous and microcrystalline silicon technology >Modeling and scaling of a-Si:H and poly-Si thin film transistors
【24h】

Modeling and scaling of a-Si:H and poly-Si thin film transistors

机译:a-Si:H和多晶硅薄膜晶体管的建模和缩放

获取原文
获取外文期刊封面目录资料

摘要

We have developed analytic SPICE models for hydrogenated amorphous silicon (a-Si:H) and polysilicon (poly-Si) thinfilm transistors (TFTs) which accurately model all regimes of operation,are temperature dependent to 150 deg C,and scale with device dimensions.These models have bene presented in [1,2].In this work,we compare the current-voltage characteiristics predicted by our models with the measured characterisitcs from TFTs fabricated at different foundries.We compare the extracted device parameters in order to evaluate the robustnessof our models and to determine a suitable default parameter set.We also use the models to examine the effects of device scaling for short channel TFTs.The models can be accuessed usifng the circuit simulator AIM-Spice [3],which is available at http:// nina.ecse.rpi.edu/aimspice.
机译:我们已经开发了用于氢化非晶硅(a-Si:H)和多晶硅(poly-Si)薄膜晶体管(TFT)的解析SPICE模型,该模型可以精确地模拟所有工作模式,温度取决于150摄氏度,并随器件尺寸而缩放这些模型在[1,2]中有所介绍。在这项工作中,我们将模型预测的电流-电压特性与在不同晶圆厂制造的TFT的测量特性进行比较。我们的模型的健壮性,并确定合适的默认参数集。我们还使用这些模型来检查短通道TFT的器件缩放的影响。可以使用电路仿真器AIM-Spice [3]来估算模型,该仿真器可从http://www.microsoft.com/en/us/im-spice/上获得。 :// nina.ecse.rpi.edu/aimspice。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号