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Pulsed-laser crystallized highly conductive boron-doped microcrystalline silicon

机译:脉冲激光结晶高导电掺硼微晶硅

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The preparation of seed lattices,using hree interfering beams (TIB) from a pulsed Nd-YAG laser in a-Si layers of 100 to 400 nm thickness is introduced and applied for seeded laser or thermally induced crystallization of a-Si on Corning 7059 glass.The structural and electronic properties of the um c-Si layers are investigated by X-ray,electron- and atomic force microscopy, Hall and conductivity measurements. In highly boron-doped um c-Si,grains up to 1.3 um m in diameter are detected,giving rise to conductivities of approx approx 2000 S/cm and hole mobilities of approx 10 cm~2/Vs.
机译:介绍了使用脉冲Nd-YAG激光在100至400 nm厚度的a-Si层中使用三束干涉光束(TIB)制备晶格的方法,并将其用于在Corning 7059玻璃上进行a-Si的晶种激光或热诱导晶化通过X射线,电子和原子力显微镜,霍尔和电导率测量研究了um c-Si层的结构和电子性能。在高硼掺杂的um c-Si中,可检测到直径最大为1.3 um的晶粒,电导率约为2000 S / cm,空穴迁移率约为10 cm〜2 / Vs。

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