首页> 外文会议>Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on >Thin solid silicone layers on the surface of model insulators made of resin and their influence on the wet surface performance under high electrical stress
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Thin solid silicone layers on the surface of model insulators made of resin and their influence on the wet surface performance under high electrical stress

机译:树脂制模型绝缘子表面上的固态硅树脂薄层及其对高电应力下湿表面性能的影响

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The paper presents investigations on processes occuring on wet and electrically stressed surfaces of insulators made of different epoxy resin systems. When manufacturing insulators in industry a silicone layer covers the surface of the metallic tool in order to enable the separation of the epoxy resin component and the tool. However, due to this a thin layer of solid silicone covets the cured epoxy resin surface as well and superimposes the properties of the insulators surface. This effect is of special importance, when diagnosing the surface conditions of new test specimen and influences the ageing performance of an electrically stressed wet surface. The investigations reported in this paper deal with stressed epoxy resin surfaces manufactured with and without any silicone layer by using special manufacturing technologies.
机译:本文介绍了在由不同环氧树脂体系制成的绝缘子的湿和电应力表面上发生的过程的研究。在工业上制造绝缘子时,硅酮层覆盖金属工具的表面,以使环氧树脂组分和工具能够分离。然而,由于这个原因,固体硅树脂的薄层也令人垂涎固化的环氧树脂表面,并且叠加了绝缘体表面的特性。当诊断新试样的表面状况并影响电应力湿表面的老化性能时,此效果尤为重要。本文报道的研究涉及通过使用特殊的制造技术在带有或不带有任何有机硅层的情况下制造的应力环氧树脂表面。

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